Soldering pallet materials similar to ricocel

TFUER-T315* Similar to RicocelT315 is a high-performance composite material commonly used as a solder pallet in printed circuit board (PCB) manufacturing processes. It is made of a blend of thermoset epoxy resin and glass fiber fabric, which gives it excellent mechanical strength, thermal stability, and chemical resistance.Thickness: 3 mm ~ 50 mm.Dimension: 1020 x 1220 mm, 1220 x 2440 mmColor: Black

Key FeaturesThermal ResistanceT315 can withstand high temperatures during soldering and reflow processes, typically up to 300°C.Can withstand temperatures up to 300°C.Suitable for high-temperature processes like wave soldering and reflow soldering.Dimensional StabilityIt resists warping and maintains its shape under extreme heat and mechanical stress.Minimal expansion or contraction under heat.Maintains precise dimensions, ensuring accuracy in critical applications.DurabilityThe material is robust, ensuring a long service life even under frequent use.Designed for long-term use with minimal wear, even in demanding produc